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TSMC Switches 2.5D Packaging from SiC to Epoxy, Dimming 2025 SiC Demand

GateNews

2026-05-16 11:33:20

According to Every Economics, Taiwan Semiconductor Manufacturing Company (TSMC) has shifted its 2.5D packaging process to epoxy-based substrates, moving away from silicon carbide (SiC) materials. Industry experts note that this technological pivot undermines the rationale for using SiC as an alternative intermediate layer in advanced packaging. SiC manufacturers faced declining revenues in 2025 amid intensified competition; however, the substrate material remains promising for applications in AI data centers and thermal management solutions.

Disclaimer: The information on this page may come from third parties and does not represent the views or opinions of Gate. The content displayed on this page is for reference only and does not constitute any financial, investment, or legal advice. Gate does not guarantee the accuracy or completeness of the information and shall not be liable for any losses arising from the use of this information. Virtual asset investments carry high risks and are subject to significant price volatility. You may lose all of your invested principal. Please fully understand the relevant risks and make prudent decisions based on your own financial situation and risk tolerance. For details, please refer to Disclaimer.

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