Intel Targets 10x Shareholder Returns Over 5-10 Years, Pursues Advanced Packaging and New Materials

According to Intel CEO Chen Li-wu in a recent podcast interview, the company is targeting 10x shareholder returns over the next 5-10 years with a clear technology roadmap focused on AI adoption across its organization. Intel plans to strengthen CPU and GPU architecture teams while narrowing its foundry gap with TSMC, with significant potential expected to materialize between 2030-2032.

Facing physical limits in process shrinking and rising costs, Intel is shifting focus to advanced packaging and compound semiconductors. The company is developing next-generation EMIB packaging solutions and manufacturing partnerships in India and New Mexico. Intel is also investing in gallium nitride (GaN), silicon carbide (SiC), and indium phosphide (InP), as well as glass substrates (via 3DGS) and synthetic diamond thermal wafers (via Diamond Foundry), holding approximately 1,000 related patents.