LG Electronics Unveils 1.4MW Direct-to-Chip Cooling Unit for AI Data Centers

Gate News message, April 21 — LG Electronics showcased new cooling and energy products for AI data center infrastructure at Data Center World 2026 in Washington, including a direct-to-chip coolant distribution unit with 1.4 megawatts of cooling capacity.

The company demonstrated inverter pumps and virtual sensors designed to improve energy efficiency, along with immersion cooling technology developed in partnership with Green Revolution Cooling and SK Enmove. LG also presented air cooling systems, a monitoring platform, and an energy optimization tool created with PADO. A direct current grid project involving LG Energy Solution and LS companies aims to reduce energy losses from approximately 25% to about 15%.

LG’s expansion into data center infrastructure is part of its broader strategy to become an AI infrastructure provider, supported by a reported investment plan of approximately $70 billion. The company has signed a turnkey supply contract with Microsoft for AI data centers and entered into an MOU with Flex for modular cooling solutions, with the goal of reducing deployment time from up to two years to six months.