According to Beating, Huawei's semiconductor chief He Tingbo released version 2 of the "Tao Theorem" paper on China's ChinaXiv preprint platform on July 3. The updated paper expands on the May 25 v1 release with engineering implementation details, quantified testing data, and a complete 8-chapter framework covering core technologies including τ hierarchical spatiotemporal models, LogicFolding architecture, bonding interface cross-sections, Unified Bus interconnect, and Hi-ONE optical engines.
The v2 paper introduces detailed explanations of LogicFolding's "gear ratio" concept and presents the first quantitative measurement table comparing Kirin 2026 with baseline Kirin 9030 Pro across voltage, frequency, normalized power consumption, area, and power density—validating Huawei's post-Moore scaling theory centered on time constant τ.